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Defects caused of Solder Paste Application and Process Optimizing
Štichová, Zuzana ; Žilina, Michal Staník, EMTEST (referee) ; Starý, Jiří (advisor)
The aim of this work is documentation of cases, where the problems appear of solder paste reflow process, evaluation and recommendation for increasing quality of proposal PCB. This work contains also recommendation of process using adhesives for double-sided SMD assembly. At the cooperation with the firm Emtest, a.s. in Žilina, I mostly intent on optimalization of proposal footprints and realization of their changes as the one way of solving the problem. I made also statistics of solder paste reproducibility by JetPrinting technology.
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Flux Residues after Reflow Soldering
Uhlář, Vít ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
The aim of this bachelor thesis is to solve flux residue characteristics on PCBś after reflow soldering and compare different solder pastes. The first part deals with the issue of solder paste application and flux residues. The second part focuses on the process of reflow soldering. The third part is devoted to the measurement methodology of flux residues. Finally, project is a practical part, which is summarized in the production of test samples and contains measurement results.
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SnBi Solder Paste and Influence of Reactive Nanoparticles
Rychlý, Ivo ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work deals with effects of nanoparticles, mainly copper and silver, on properities of lead-free solder pastes. It describes basic tests done on solder pastes according to IPC-TM-650 standards. In practical section this work focuses on the preparation of Sn-Bi solder paste and the measuring of viscosity. After that different concentrations of silver copper alloy nanoparticles are added to the SnBi solder paste. These solder pastes are tested by the IPC standarts and mechanical and resistive tests are done on printed circuit boards where the effects of mixed in nanoparticles are observed.
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Trends in Solder Paste Area and Nanoparticles Influence
Dosedla, Milan ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This thesis deals with novel trends in solder paste technology. It focuses on nanoparticle applications used as a tool for improving a state of the art lead free solder alloys. The recently published results about the impact of different types of nanoparticles on properties of newly-emerged nanocomposite solders are discussed and summarized in the thesis. Preparation, practical application and testing of new solder paste based on low temperature SnBi alloy with an admixture of titanium dioxide are also discussed. Finally, properties of solder joints using these solder pastes are investigated and the results are evaluated.
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Inspection and optimization of soldering profiles of reflow furnaces
Flos, Milan ; Zatloukal, Miroslav (referee) ; Bača, Petr (advisor)
This thesis is focused on the implementation of solutions for the control of temperature profiles in an industrial environment. The theoretical part deals with the soldering process itself, individual types of soldering and their possible defects. Furthermore, the problem of temperature profiles, their division and the advantages and disadvantages of individual profiles were discussed. Subsequently, the measurement was performed on several remelting furnaces and its evaluation. Lastly, the design of the holder for the profilometer and the PCB itself was created.
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Problems in Solder Paste Stencil Printing for Fine Pitch Components
Šimeček, Ondřej ; Polsterová, Helena (referee) ; Starý, Jiří (advisor)
Despote the indisputable advantages of fine-pitch components, is need to calculate with a few trouble during production, especially increased requirements for accuracy of mounting and solder printing. In this work I’m concerned with problems of solder printing for these components and evaluation using SPC. For the evaluation I used 3D paste inspection based on laser scanning of the surface. The output of this work is to describe the principles of solder printing and elaborating of GR&R, SPC analysis and histograms of solder printing for some outputs. I focused in my master thesis on motive design change of problematic components and economic evaluation of the adjustments.
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Reliability of LED Panels Solder Joints
Šimon, Vojtěch ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
Thesis is focused on the effect of heating factor on quality of solder joints. In theoretical part is solved reflow soldering technology, problematice of solder paste choice or criteria of soldering profile setting. The practical part is dedicated to demonstrating the impact of heating factor on solder joint quality. There are used X-Ray analysis, microsections and electron microscopy. In the final part of this thesis are summarized knowledge from theoretical part and experimental obtained results to defend of next steps in diploma thesis.
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Reactive Nanoparticles Application to SAC 305 Solder Paste
Matras, Jan ; Špinka, Jiří (referee) ; Starý, Jiří (advisor)
This work is a research on the topic of reactive nanoparticles and their agitation into the solder paste, which it also describes. It describes in detail the properties of each solder alloys. It explains the creation of intermetallic layers in the soldering process and examines their structure. It also focuses on the evaluation and methodology of testing the properties of solder pastes. In the practical part, individual tests are performed with PF606 and PF610 solder paste.
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Inspection and optimization of soldering profiles of reflow furnaces
Flos, Milan ; Zatloukal, Miroslav (referee) ; Bača, Petr (advisor)
This thesis is focused on the implementation of solutions for the control of temperature profiles in an industrial environment. The theoretical part deals with the soldering process itself, individual types of soldering and their possible defects. Furthermore, the problem of temperature profiles, their division and the advantages and disadvantages of individual profiles were discussed. Subsequently, the measurement was performed on several remelting furnaces and its evaluation. Lastly, the design of the holder for the profilometer and the PCB itself was created.
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